ST is sampling automotive MCUs containing phase-change memory made on a 28nm FDSOI process. Full technology qualification is expected in 2020.
“Having applied ST’s process, design, technology, and application expertise to ePCM, we’ve developed an innovative recipe that makes ST the very first to combine this non-volatile memory with 28nm FD-SOI for high-performance, low-power automotive microcontrollers,”says Marco Monti, President Automotive and Discrete Group, STMicroelectronics, “With samples already in some lead-customers’ hands, we’re confirming the outstanding temperature performance of ePCM and its ability to meet all automotive standards, further assuring our confidence in its market adoption and success.”
The MCUs—the world’s first to use ePCM—will target powertrain systems, advanced and secure gateways, safety/ADAS applications, and Vehicle Electrification.
One of the most challenging automotive demands is for larger embedded memories as firmware complexity and size increase dramatically.
ePCM presents a solution to these chip- and system-level challenges, meeting automotive requirements for AEC-Q100 Grade 0, operating at temperature up to +165°C.
In addition, ST’s technology assures firmware/data retention through high-temperature soldering reflow processes and immunity to radiation, for additional data safety.